发明名称 |
Heat pipe type heat dissipation device |
摘要 |
A heat pipe type heat dissipation device for an electronic component comprises a base plate, a cover plate spaced from the base plate, a plurality of parallel fins extending between the base plate and the cover plate and connecting with them. The base plate, the cover plate and each two adjacent fins collectively define a unitary air passage. The base plate has a protuberant portion, which has a convex surface facing towards the cover plate and has a thickness getting small from the middle to two sides in a direction parallel to the fins. The cover plate also has a protuberant portion similar to the protuberant portion of the base plate. A heat pipe connects the protuberant portions of the cover plate and the base plate.
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申请公布号 |
US7448438(B2) |
申请公布日期 |
2008.11.11 |
申请号 |
US20060309622 |
申请日期 |
2006.09.01 |
申请人 |
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
XIA WAN-LIN;ZHONG YONG;LONG JUN |
分类号 |
F28D15/00;F28F7/00;H05K7/20 |
主分类号 |
F28D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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