| 摘要 |
An apparatus for enclosing electronic components comprises a chassis enclosure defining an internal chamber and having an upper portion and a lower portion. The upper portion comprises a first front wall having a length dimension greater than a width dimension, and a first pair of opposing side walls that are each contiguous with the first front wall. The lower portion comprises a second front wall having a length dimension less than the length dimension of the first front wall, and a second pair of opposing side walls that are each contiguous with the second front wall. A plurality of heat sink fins are on each of the first front and side walls, and on each of the second front and side walls. Each of the heat sink fins are configured to be substantially parallel to the length dimension of the first front wall and the second front wall, and extend continuously along each wall. The plurality of heat sink fins has an arcuate-like end view profile on each wall of the chassis enclosure.
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