PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME

摘要

An electro device built-in PCB(Printed Circuit Board) is provided to simplify its manufacturing process by skipping a punch process of a cavity or a process which uses an adhesive tape. Some part of electronic device is indented to a first insulation layer(S100), and a second insulation layer is stacked on the first insulation layer to indent the rest part of the electronic device to the second insulation layer(S200). A blind via-hole is punched on the first or second insulation layer(S300). A first blind via-hole is formed by plating the blind via-hole(S400), and a circuit pattern is formed at another planes of the first and second insulation layers(S500).