发明名称 |
Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate |
摘要 |
A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
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申请公布号 |
US7449381(B2) |
申请公布日期 |
2008.11.11 |
申请号 |
US20060352279 |
申请日期 |
2006.02.13 |
申请人 |
ENDICOTT INTERCONECT TECHNOLOGIES, INC. |
发明人 |
DAS RABINDRA N.;LAUFFER JOHN M.;LIN HOW T.;MARKOVICH VOYA R. |
分类号 |
H01L21/8234;H01L21/00 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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