发明名称 Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
摘要 A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
申请公布号 US7449381(B2) 申请公布日期 2008.11.11
申请号 US20060352279 申请日期 2006.02.13
申请人 ENDICOTT INTERCONECT TECHNOLOGIES, INC. 发明人 DAS RABINDRA N.;LAUFFER JOHN M.;LIN HOW T.;MARKOVICH VOYA R.
分类号 H01L21/8234;H01L21/00 主分类号 H01L21/8234
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