| 摘要 |
Apparatus for thermoelectric cooling of an insulated enclosure having a plurality of thermoelectric cooling units, with their cold sides exposed to the enclosure interior, where they are affixed to an array of individual, self-sufficient interior heat pipes through a conductive metal connecting member. Their hot sides are exposed to the ambient exterior and similarly affixed to an array of individual, self-sufficient exterior heat pipes, each set of heat pipes having a stack of fins affixed; interior fins to collect heat and exterior fins to disburse heat.
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