发明名称 |
Mold compound cap in a flip multi-matrix array package and process of making same |
摘要 |
A molding compound cap structure is disclosed. A process of forming the molding compound cap structure is also disclosed. A microelectronic package is also disclosed that uses the molding compound cap structure. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the molding compound cap structure. The molding compound cap includes a configuration that exposes a portion of a microelectronic device. |
申请公布号 |
HK1100102(A1) |
申请公布日期 |
2008.11.07 |
申请号 |
HK20070107995 |
申请日期 |
2007.07.24 |
申请人 |
INTEL CORPORATION |
发明人 |
VASSOUDEVANE LEBONHEUR;RICHARD HARRIES |
分类号 |
H01L;H01L21/56;H01L23/31 |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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