SEMICONDUCTOR DEVICE

摘要

Provided is a semiconductor module, which is mounted on a vehicle and is provided with a semiconductor element, a forced-cooling type cooler and a heat mass. Heat generated by the semiconductor element is transferred to the cooler. The heat mass is bonded on the semiconductor element to be thermally coupled to the semiconductor element. The heat mass is so formed as to have thermal resistance of a portion of the heat mass that corresponds to a high-temperature portion of the semiconductor element in a heat generating state lower than the thermal resistance of a portion of the heat mass that corresponds to a low-temperature portion of the semiconductor element.