发明名称 SILICONE RESIN, SILICONE RESIN COMPOSITION AND METHOD FOR FORMING TRENCH ISOLATION
摘要 PROBLEM TO BE SOLVED: To provide a silicon dioxide precursor and a silicon dioxide precursor composition useful for forming a high purity silicon dioxide film containing no organic component. SOLUTION: The silicon dioxide precursor is a silicone resin that is represented by the rational formula (1) (H<SB>2</SB>SiO)<SB>n</SB>(HSiO<SB>1.5</SB>)<SB>m</SB>(SiO<SB>2</SB>)<SB>k</SB>, wherein each n, m and k represents a number, and when n+m+k=1, n is not less than 0.05, m is over 0 to 0.95 and k is from 0 to 0.2, and that is solid at 120°C. The silicon dioxide precursor composition contains the above silicone resin and an organic solvent. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008266119(A) 申请公布日期 2008.11.06
申请号 JP20070253276 申请日期 2007.09.28
申请人 JSR CORP 发明人 IWAZAWA HARUO;MATSUKI YASUO;TAMAKI KENTARO
分类号 C01B33/12;B05D7/24;C08G77/12;H01L21/316;H01L21/76 主分类号 C01B33/12
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