| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate which is appropriately used, for example, in the production of a printed wiring board and is excellent in adhesion to an electroless plating membrane, in reliability, and in minute wiring formabilities, and also to provide its typical utilization technique. SOLUTION: In the laminate having at least a layer A made of a resin composition component containing a resin having a specified structure on at least one side of a polymer film, a metal layer in which the number of pinholes per square meter is 10 or less is formed on the surface of the layer A of a resin material comprising the polymer film and the layer A. COPYRIGHT: (C)2009,JPO&INPIT |
