| 摘要 |
PROBLEM TO BE SOLVED: To heighten production efficiency by reducing labors required for measuring thickness in a step for grinding a wafer while grasping a wafer thickness in a grinding device capable of adjusting the wafer thickness to a desired condition by adjusting an inclined angle of a chuck table. SOLUTION: A finish thickness measuring device 80 for measuring thickness of only a secondary ground wafer 1 at a plurality of points in a radial direction is installed near a secondary grinding position, so as to grasp thickness distribution in the radial direction of the wafer 1 from the thickness of the wafer 1 measured by the device 80. Based on the grasped thickness distribution in the radial direction, a chuck table 20 is inclined by an inclined angle adjusting mechanism 70, and an angle of the wafer 1 relative to a grinding wheel 37 is appropriately adjusted, so as to make the wafer thickness after secondary grinding into a desired condition. COPYRIGHT: (C)2009,JPO&INPIT
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