POLYIMIDE COMPOSITION AND FLEXIBLE WIRING BOARD

摘要

Disclosed is a polyimide composition which comprises a polyimide compound having high alkali solubility and a resol resin, which has improved plating resistance, and which does not cause the reduction in thickness when developed with an aqueous alkali solution. Also disclosed is a flexible wiring board using the polyimide composition. A polyimide compound which is produced by polymerizing 3,3',4,4'-diphenylsulfonetetracarboxylic acid dianhydride and 3,3'-diamino-4,4'-dihydroxydiphenylsulfone has high alkali solubility. Therefore, a mixture of the polyimide compound with a photosensitizing agent can be developed with an alkali excellently.Further, a mixture of the polyimide compound with 1 to 4 parts by weight of a resol resin can be developed excellently with an aqueous alkali solution to form a desired pattern. Thus, a polyimide compound and a flexible wiring board each having plating resistance can be provided.