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发明名称
Lötpad-Anordnung und Verbindungsstruktur für mehrlagige Leiterplatten
摘要
申请公布号
DE69739005(D1)
申请公布日期
2008.11.06
申请号
DE1997639005
申请日期
1997.07.25
申请人
IBIDEN CO. LTD.
发明人
ASAI, MOTOO
分类号
H01L23/498;H05K3/28;H01L23/12;H05K1/11;H05K3/34;H05K3/46
主分类号
H01L23/498
代理机构
代理人
主权项
地址
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