| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package of a fabric semiconductor device, in which, by using a fabric printed circuit board which consists of textile fabrics, sense of inconsistency can be minimized, and the package of the fabric semiconductor device can be easily mounted, and the productivity of the package of the fabric semiconductor device can be improved. <P>SOLUTION: The package of the fabric semiconductor device comprises a fabric printed circuit board which has textile fabrics, and a lead part formed by patterning a conductive material on the textile fabrics; a semiconductor device which has an electrode connected to the lead part of the fabric printed circuit board; and a molding part which seals the fabric printed circuit board and the semiconductor device. <P>COPYRIGHT: (C)2009,JPO&INPIT |
