| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which has a thinned semiconductor element maintaining planarity and is suitable to obtain an easily assembled thinned structure, and to provide a manufacturing method thereof. <P>SOLUTION: The multilayer wiring board has a structure in which a semiconductor element 3 is bonded between first and second substrate materials 1 and 2 which are face-to-face disposed. The first substrate material 1 is provided with a wiring board having a wiring layer 1b formed on one surface of an insulating substrate 1a, and a conductive paste-made through electrode 1c piercing through the insulating substrate and having one end connected to the wiring layer and the other end exposed to the other surface of the insulating substrate. The semiconductor element 3 is provided with an electrode pad 3b formed on one surface of the semiconductor substrate 3a, a protective insulating film 3c having a contact hole, a re-wiring layer 3e formed thereon and connected to the electrode pad, and a first insulating film 3d, 3f for forming the re-wiring layer, and a second insulating film 3h formed on the other surface of the semiconductor substrate. The other end of the through electrode 1c is connected to the re-wiring layer 3e. <P>COPYRIGHT: (C)2009,JPO&INPIT |
