| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-dissipating resin composition which is used for forming a substrate for mounting an LED or a reflector provided on the substrate for mounting an LED, and is excellent in heat dissipation, electrical insulation, heat resistance, and light resistance, when the LED element is emitting light, and a substrate for mounting an LED and a reflector containing the composition. <P>SOLUTION: The heat-dissipating resin composition contains a thermoplastic resin such as modified PBT (PolyButylene-Terephthalate) and a thermally conductive filler such as flake boron nitride. The composition has a thermal deformation temperature not less than 120°C, thermal conductivity not less than 2.0 W/(m×K), and heat emissivity not less than 0.7. <P>COPYRIGHT: (C)2009,JPO&INPIT |
