| 摘要 |
PROBLEM TO BE SOLVED: To achieve a semiconductor package with which a forged article can be easily identified. SOLUTION: A semiconductor package of the present invention seals a semiconductor chip with a resin, one surface of the semiconductor package is formed from aventurine 1 with first surface coarseness, characters 12 of a product number or the like formed from aventurine 2 having second surface coarseness are provided on the aventurine 1, and the aventurine 1 and the aventurine 2 have the same reference plane. COPYRIGHT: (C)2009,JPO&INPIT
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