发明名称 A METHOD OF PLASTICS ENCAPSULATING AN ASSEMBLY OF ELECTRICAL COMPONENTS
摘要 1278648 Encapsulated electrical components MOTOROLA Inc 12 Aug 1969 [21 Aug 1968] 36597/71 Divided out of 1278647 Heading B5A [Also in Division H1] The subject-matter of the Specification is substantially fully disclosed in Specification 1,278,647, but the claims relate to a method and apparatus for plastics encapsulating an electrical assembly having a radially outwardly extending portion which contains no active components. This portion is arranged to enter an annular die cavity defined between two annular dies 65, 66, plastics material being injected through a mould runner 67 to fill the cavity and hence to seal the outer periphery of the electrical assembly. During the moulding process the central portion of the assembly containing the active components, e.g. thyristor 18, is accommodated within the hollow core 61 of the annular dies 65, 66 and therefore is subjected to no pressure.
申请公布号 GB1278648(A) 申请公布日期 1972.06.21
申请号 GB19710036597 申请日期 1969.08.12
申请人 MOTOROLA, INC. 发明人 DAVID EVANS COOPER;ALVIN MARION SMITH
分类号 H01L23/051;H01L23/16 主分类号 H01L23/051
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