发明名称 |
PLANAR INTERCONNECT STRUCTURE FOR HYBRID CIRCUITS |
摘要 |
Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
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申请公布号 |
US2008272496(A1) |
申请公布日期 |
2008.11.06 |
申请号 |
US20070743644 |
申请日期 |
2007.05.02 |
申请人 |
STARKEY LABORATORIES, INC. |
发明人 |
DUMAS CRAIG;SUNDERMURTHY VIJAYKUMAR |
分类号 |
H01L23/48;H01L21/4763 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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