发明名称 |
Package substrate and its solder pad |
摘要 |
A semiconductor chip substrate with solder pad includes: a core layer and at least one conductive structure formed on the surface of the core layer; an insulation layer with at least one patterned opening covering the conductive structure, wherein the patterned opening has a center portion and a plurality of wing portions on the peripheral edge of the center portion to define the exposed area of the conductive structure as the solder pad. The solder pad with wing will improve the adhesion effect between the solder pad and the solder ball.
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申请公布号 |
US2008272489(A1) |
申请公布日期 |
2008.11.06 |
申请号 |
US20070824448 |
申请日期 |
2007.06.29 |
申请人 |
POWERTECH TECHNOLOGY INC. |
发明人 |
FANG LI-CHIH;IWATA RONALD;FAN WEN-JENG |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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