METAL-RESIN LAMINATE

摘要

It is intended to provide a metal-resin laminate, which contains a metal foil having a small surface roughness and a thermoplastic polyimide having a high adhesiveness and a low hygroscopic expansion coefficient, and is useful as a material particularly for a flexible printed wiring board. The laminate of the invention is characterized by comprising a metal foil with a surface having an arithmetic average roughness Ra of 0.20 µm or less and/or a ten-point average roughness Rz of 0.70 µm or less; a thermoplastic polyimide layer containing a specific chemical structure provided on the surface of the metal foil; and a resin layer provided on the thermoplastic polyimide layer.