CLEANING APPARATUS AND CLEANING METHOD OF SEMICONDUCTOR WAFER

摘要

A cleaning apparatus and a cleaning method of semiconductor wafer are provided to effectively remove the particle of the semiconductor wafer surface through the cleaning gas jet and electric field generation. The cleaning device for removing the particle(204a) generated on the surface of the semiconductor wafer(204) in the specific pattern formation includes the wafer fixing part(202) fixing the semiconductor wafer with grounded; the gas injector(206) spraying the cleaning gas to the semiconductor wafer surface; the field generation part generating the electric field of the set level. The field generation part is spaced from the wafer fixing part.