| 摘要 |
PROBLEM TO BE SOLVED: To provide an acoustic sensor capable of improving acoustic characteristics, while its package can be miniaturized. SOLUTION: The acoustic sensor comprises an electrostatic capacity type acoustic sensor chip 10, an IC chip 20 for collaborating with the acoustic sensor chip 10, a package 30 for containing the acoustic sensor chip 10 and the IC chip 20. The acoustic sensor chip 10 is packaged in a package 30, in a fashion with a wave receiving plane of a diaphragm-like vibrating plate portion 12 facing a sound wave introducing portion 33 of the package 30. The IC chip 20 is arranged face-to-face at a side opposite to the vibrating plate portion 12 side in a backing-plate portion 14 of the acoustic sensor chip 10. In addition, a space 16 on the side of the backing-plate portion 14 in the vibrating plate portion 12 and a cavity 34, which is an internal space of the package 30, are jointed to the acoustic sensor chip 10, in such a way that they communicate with each other. COPYRIGHT: (C)2009,JPO&INPIT
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