发明名称 MOISTURE-CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a low-toxic moisture-curable resin composition which is slight in curing delay with the elapse of time, while having a practical curing rate. SOLUTION: The moisture-curable resin composition comprises (A) a curable silicone-based resin having in the molecule silicon-containing characteristic groups each represented by general formula (1) (wherein, R<SP>1</SP>and R<SP>2</SP>are each a 1C or 2C hydrocarbon group; and n is 1, 2 or 3), (B) a silane compound such as a silicate compound represented by general formula (2) (wherein, R<SP>3</SP>is a 3C or 4C hydrocarbon group) and (C) boron trifluoride and/or its derivative as a hydrolysis catalyst. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008266521(A) 申请公布日期 2008.11.06
申请号 JP20070114442 申请日期 2007.04.24
申请人 KONISHI CO LTD 发明人 INUI JUN;IYO KAZUHIRO;NOMURA YUKIHIRO;INOUE MAI;SATO SHINICHI
分类号 C08G18/67;C08G18/10;C08K5/5415;C08L33/14;C08L71/02 主分类号 C08G18/67
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