发明名称 |
GALLIUM NITRIDE SUBSTRATE AND GALLIUM NITRIDE FILM DEPOSITION METHOD |
摘要 |
A gallium nitride substrate and a gallium nitride film deposition method are provided to decrease the generation rate of the crack of the nitride gallium film. The formation method of the nitride gallium film in which the carrier concentration is 1x10^17cm^p-3 or greater includes: the process of forming the nitride gallium film(51) including N-type dopant on the substrate(50); the process of heating up the nitride gallium film formed in the top of the substrate. The nitride gallium film is heated more than 5 minutes at 800°C or greater.
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申请公布号 |
KR20080097938(A) |
申请公布日期 |
2008.11.06 |
申请号 |
KR20080040659 |
申请日期 |
2008.04.30 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NAKAHATA SEIJI |
分类号 |
H01L21/20;H01L33/06;H01L33/32 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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