| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a solder fillet can be stably formed on an end surface of an external electrode even when plating is not performed. SOLUTION: Along a two-dot broken line 26, a V-shaped groove is formed on a peeling surface of a metal plate 23 in a resin sealed material 25. When forming the V-shaped groove, a blade 27 whose cutting edge has V-shape is used. Then, using a cutting blade 28, the resin sealed material 25 is cut along the two-dot broken line 26. Then one resin sealed material 25 is divided to bring the semiconductor device 1 to completion. COPYRIGHT: (C)2009,JPO&INPIT |
