发明名称 CONDUCTIVE CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive connection structure having a high conductivity and which is capable of enhancing adhesive force between base materials in a connection between conductive parts which are respectively provided on different base materials, and to provide a method of manufacturing the same. SOLUTION: In a conductive connection structure 10, a first base material 11 and a second base material 14 are adhered via an adhesive layer 18 consisting of a film-shaped adhesive agent. A conductive part 12 provided on one side 11a of the first base material 11 and a conductive part 15 provided on one side 14a of the second base material 14 are electrically connected with each other. One of a cross-sectional shape of the conductive part 12 of the first base material 11 and that of the conductive part 14 of the second base material 15 has a convex shape, and the other has a concave shape joining with the convex shape. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008270639(A) 申请公布日期 2008.11.06
申请号 JP20070114004 申请日期 2007.04.24
申请人 TOPPAN FORMS CO LTD 发明人 OYA SHUNSUKE
分类号 H05K3/32;H01L21/60;H05K3/34 主分类号 H05K3/32
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