| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation arrangement of electronic parts which improves heat dissipation efficiency of a printed board, and reduces a projection area while the number of parts is decreased for more efficient assembly man-hours. SOLUTION: The heat dissipation arrangement includes a metal core substrate 10 where a plurality of electronic parts including a heating part 5 are formed on one surface, a shield case 11 having a U-shape cross section which is bonded to the other surface of the metal core substrate 10, and a main printed board 1. The shield case 11 having a U-shape cross section is so secured to the main printed board 1 as to cover the electronic parts. COPYRIGHT: (C)2009,JPO&INPIT
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