发明名称 HIGH-FREQUENCY CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency circuit which can stabilize high-frequency characteristics by keeping a housing and a multilayer substrate at the same potential in the high frequency sense. SOLUTION: A solid-state power amplifier 21 comprises: the housing 24 consisting of a bottomed case 22 with an opening portion 22a on one end and a lid 23 attached to the case 22 so as to close the opening portion 22a; the multilayer substrate 25 which has high-frequency signal lines 28 consisting of strip lines in insulation layers 26 and 27 interposed between upper and lower ground conductor layers 29 and 30 and is housed in the case 22 in such a manner that the lower ground conductor layer 30 may be in contact with the case 22; and a screw 34 for fixing the lid 23 to the case 22. A metallic spring sheet 33 is inserted between the multilayer substrate 25 and the lid 23, and the lid 23 pushes the multilayer substrate 25 toward the bottom face of the case 22 via the spring sheet 33. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008270481(A) 申请公布日期 2008.11.06
申请号 JP20070110594 申请日期 2007.04.19
申请人 JAPAN RADIO CO LTD 发明人 ITO HIROSHI;ISHIDA KATSUYOSHI;YOSHIDA KIYOMI;ASO SHUJI
分类号 H01L23/12 主分类号 H01L23/12
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