发明名称 |
SEMICONDUCTOR DEVICE, WAFER AND METHOD OF DESIGNING AND MANUFACTURING THE SAME |
摘要 |
A process margin of an interconnect is to be expanded, to minimize the impact of vibration generated during a scanning motion of a scanning type exposure equipment. In a semiconductor device, the interconnect handling a greater amount of data (frequently used interconnect) is disposed in a same orientation such that the longitudinal direction of the interconnects is aligned with a scanning direction of a scanning type exposure equipment, in an interconnect layer that includes a narrowest interconnect or a narrowest spacing between the interconnects. Aligning thus the direction of the vibration with the longitudinal direction of the pattern can minimize the positional deviation due to the vibration.
|
申请公布号 |
US2008274586(A1) |
申请公布日期 |
2008.11.06 |
申请号 |
US20070951354 |
申请日期 |
2007.12.06 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
MATSUBARA YOSHIHISA;KOBAYASHI HIROMASA |
分类号 |
H01L21/00;H01L21/4763 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|