发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which is excellent in resolution and improves pattern collapse even in the formation of a fine pattern of &le;100 nm and a pattern forming method using the same, with respect to a positive photosensitive composition for use in the production process of a semiconductor such as IC, in the production of a circuit board of liquid crystal, thermal head and the like or in other photofabrication processes and a pattern forming method using the same. <P>SOLUTION: The positive photosensitive composition comprises (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation, and (B) a resin which has a repeating unit having two ester groups in a side chain, and decomposes by the action of an acid to increase its solubility in an alkali developer. The pattern forming method using the same is also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008268740(A) 申请公布日期 2008.11.06
申请号 JP20070114490 申请日期 2007.04.24
申请人 FUJIFILM CORP 发明人 KODAMA KUNIHIKO
分类号 G03F7/039;C08F20/12;C08F32/08;H01L21/027 主分类号 G03F7/039
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