| 摘要 |
The invention comprises a process for joining a first surface and a second surface where the first surface comprises an initially non-solderable surface which comprises coating the first surface with a solder-adhesion layer to produce a solder-adhesion layer on the first surface and providing a Thermal Interface Material ("TIM") composition comprising solderable heat-conducting particles in a bondable resin matrix where at least some of the solderable heat-conducting particles comprise a solder surface. The TIM composition is placed between the first surface and the second surface to extend between and be contiguous with both the second surface and the solder-adhesion layer on the first surface. Sufficiently heating the TIM composition results in (a) soldering at least some of the solderable heat-conducting particles to one another; and (b) soldering at least some of the solderable heat-conducting particles to the solder-adhesion layer on the first surface. When the second surface comprises a solderable surface, the particles will also bond to it. When the second surface is not solderable, a solder adhesion layer can be placed on it. The process also includes adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device such as a semiconductor device and the second surface can comprise a heat sink, such as a solderable heat sink. The invention also comprises a process for improving the heat conductivity of a TIM, an article of manufacture made by the process, and a composition of matter comprising the TIM.
|
