| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve solder connection reliability of a multilayer structure printed wiring board of a metal base or metal core type. <P>SOLUTION: The printed wiring board of a metal base or metal core type having a metal plate has a multilayer structure 3 configured by laminating a plurality of base materials 2 and metal wiring layers 1. This multilayer structure 3 is bonded on a metal plate 4 via a heat transfer insulating resin 5, and the base materials 2 of the multilayer structure 3 are each an epoxy resin and have a tensile elasticity of≤400 MPa at -40°C. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
