发明名称 WIRE COMPOSITE PRINTED-WIRING BOARD, ITS MANUFACTURING METHOD, WIRE PART, MANUFACTURING METHOD FOR WIRE PART AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a wire composite printed-wiring board enabling a free configuration and having a high reliability on a connection between a conductor and a first conductor layer, a manufacturing method for the wire composite printed-wiring board, a wire part, a manufacturing method for the wire part and electronic equipment loading such a wire composite printed-wiring board. SOLUTION: A resin sealing section 39 resin-sealing the end section of the wire part 30 with the conductor and a first wiring board are juxtaposed, and a second wiring board with a second insulating base material 21 and a second conductor-layer pattern 22p is laminated on the resin sealing section 39 and the first wiring board. An extended terminal 32 for the conductor with an extended board section 32f for the conductor opposed to first conductor-layer patterns 12p extended from the resin sealing section 39 is connected to a conductor, and the extended board section 32f for the conductor is connected to the first conductor-layer patterns 12p through a conductive hole conductor formed to the interlayer conductive hole of the second insulating base material 21 passing through the connecting hole 32h of the extended board section 32f for the conductor and reaching the first conductor-layer patterns 12p. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008270361(A) 申请公布日期 2008.11.06
申请号 JP20070108472 申请日期 2007.04.17
申请人 SHARP CORP 发明人 KASHIO HITOSHI
分类号 H05K3/46 主分类号 H05K3/46
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