| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the soldering state of a lead component cannot be inspected when a soldering part is behind the back of the lead component and that the whole number of the soldering states cannot be inspected when the recognition of the soldering states is performed in destruction inspection since the shape of solder at the face of the lead component fitting side of a circuit board is inspected by viewing and an X-ray and the like in a conventional inspecting method of the soldering state of the lead component. SOLUTION: Check pins 13 which are arranged near leads of soldering objects 12 and electrically parted from the leads of soldering objects 12 are arranged. The check pins 13 are electrically connected to the leads of soldering objects 12 which correspond to the check pins 13 by fillets 40a formed at solders 40 sucked to insertion sides 20m of the leads of the soldering objects 12 in connection terminals 20a of the circuit board 20 through holes 21 in a state that the lead component 10 is mounted to the circuit board 20. COPYRIGHT: (C)2009,JPO&INPIT
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