| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of processing a very thin semiconductor wafer or material, without causing defects such as chipping of a chip or IC parts at peeling, by obtaining sufficient expandability when picking up after dicing while maintaining transmissivity of a liquid caused by a liquid flow, relating to a water jet laser dicing. SOLUTION: An adhesive sheet for water jet laser dicing has an adhesive agent layer stacked on a base material film. The adhesive sheet is for water jet laser dicing, which has through holes, with voidage of 3-90% and elongation at break being 100% or higher. COPYRIGHT: (C)2009,JPO&INPIT
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