| 摘要 |
PROBLEM TO BE SOLVED: To control insulating plate deformation due to sealing material deformation and defective soldering due to such deformation without changing the height of a product in a chip type electrolytic capacitor. SOLUTION: The chip type electrolytic capacitor is constituted by mounting a capacitor body formed of a capacitor element 1 that is formed by connecting a lead wire 3 for extracting an electrode to anode and cathode foils each having a dielectric material film on a metal foil working as a valve and laminating and winding the lead wire via a separator, a cylindrical accommodation vessel 2 having the bottom for accommodating the capacitor element 1 impregnated with the electrolyte, and an elastic sealing material 4 for sealing an aperture end of the accommodation vessel 2 and having a through-hole for inserting a pair of extracting lead wires 3 connected to the capacitor element 1, and an insulating plate 5 that is formed of a resin material or the like and includes a hole for inserting a pair of guiding lead wires and a groove. In this chip type electrolytic capacitor, a recess 5b having a surface area wider than that of a circular center region R in internal contact with the guiding lead wire inserting holes is provided in the side facing to the capacitor body sealing part side of the insulating plate 5. COPYRIGHT: (C)2009,JPO&INPIT
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