| 摘要 |
PROBLEM TO BE SOLVED: To improve the throughput of a substrate as an object to be inspected, in a TFT substrate inspection apparatus. SOLUTION: The TFT substrate inspection apparatus includes an inspection chamber in which the substrate introduced is subjected to inspection, a load lock chamber through which the TFT substrate is introduced into the inspection chamber, and an unload lock chamber through which the TFT substrate is taken out from the inspection chamber. The inspection chamber is comprised of a plurality of sub-inspection chambers connected to one another in turn on a substrate transporting path formed between the load lock chamber and the unload lock chamber. Each of the sub-inspection chambers constituting the inspection chamber has an electron gun and a sensor arranged therein such that the transportation direction of the substrate and the scanning direction coincide with each other; accordingly, transporting the substrate in the transporting direction causes the inspection to be performed. The inspection performed in each of the sub-inspection chambers constitutes one of the divided scans of the total scan on the substrate performed in a plurality of batches; accordingly, combining the divided scans performed in the respective sub-inspection chambers constitutes the total scan of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
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