发明名称 EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a building sealing material epoxy resin composition which has a large thixotropic property, does not drip, and can lightly be handled with spatulas. SOLUTION: This epoxy resin composition is characterized by comprising fine silica powder, a silyl group-terminated polyalkylene oxide resin and a polyalkylene imine resin and having a loss modulus of≤8,000 Pa and a phase differenceδof≤10°. Thereby, the epoxy resin composition has both a non-dripping property and workability as a building sealing material. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008266357(A) 申请公布日期 2008.11.06
申请号 JP20070106873 申请日期 2007.04.16
申请人 AICA KOGYO CO LTD 发明人 YOSHIDA TOMOYUKI
分类号 C08L63/00;C08K3/36;C08L71/02;C08L79/02;C09K3/10 主分类号 C08L63/00
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