| 摘要 |
PROBLEM TO BE SOLVED: To provide a satisfactory electroless gold plating method for an electronic component where electroless gold plating is directly applied to the surface formed of a copper circuit of a printed wiring board, a flexible wiring board or the like, or of a copper based stock of a semiconductor package board or the like, and excellent heat resistance and reflow resistance are imparted to a solder joined terminal or the like, and to provide an electronic component. SOLUTION: In the electroless gold plating method for an electronic component where an substitution gold plating film is formed on an electronic component having the part to be plated composed of a copper or copper alloy based stock, and electroless gold plating is further applied thereto with an electroless gold plating liquid comprising a reducing agent, the reducing agent in the electroless gold plating liquid is a phenyl compound based reducing agent expressed by general formula (1); wherein, R1 denotes a hydroxyl group, a sulfonic group or an amino group; and R2, R3 and R4 independently denote a hydroxyl group, a sulfonic group, an amino group, a hydrogen atom or an alkyl group, respectively. COPYRIGHT: (C)2009,JPO&INPIT |
