| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device that can be manufactured in a simplified process. <P>SOLUTION: The light-emitting device including a package body that has first and second principal planes, a plurality of sides therebetween, is individually separated into first and second level regions containing the first and the second principal planes, and is formed of curing resin, first and second external terminal blocks that are individually disposed on both ends of the package body, have sides between the first and the second planes, the first plane is exposed on the first principal plane of the package body and have a connection section that is communicated with another plane exposed on a portion positioned inside the package body, a light-emitting diode chip that is positioned between the first and the second external terminal blocks in the first level region and has an electrode formation plane where first and second electrodes are formed, and wires that electrically connect the first and the second electrodes of the light-emitting diode chip with the connection sections of the first and the second external terminal blocks, respectively, is provided. <P>COPYRIGHT: (C)2009,JPO&INPIT |
