STACK STRUCTURE BODY HAVING RELEASE LAYER AND METHOD FOR FORMING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a structure body that does not cause fine cracks in a chip before performing wire bonding and a method for forming the same.

SOLUTION: The structure, a package structure body of laminated dies, and the method for forming the same, wherein an elastic adhesive layer provided on a first die covers the entire upper surface of the first die to form a frame on a first peripheral end except for an opening formed on a first contact pad. The fine cracks that are generated in the die are prevented when performing the wire bonding on the contact pad of the die using the shape of the elastic adhesive layer.

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