| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small semiconductor device in which the deformation of a lead is prevented in wire bonding. <P>SOLUTION: The semiconductor device 10A is provided with an island 11, a semiconductor element 13 mounted on the bottom surface of the island 11, and leads 20C, 20F provided so as to approach to the island 11, and a sealing resin 38 for integrally sealing these constituents. In the semiconductor device 10A, an electrode 19A, and the like, of the semiconductor element 13 are connected to a lead adjacent to a side where a lead 20B, and the like, continuing from the island 11 are not provided. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
