| 摘要 |
PROBLEM TO BE SOLVED: To solve a matter that the relative misalignment of an interconnect and a via plug cannot be detected by a conventional misalignment pattern. SOLUTION: The misalignment detection pattern 1 is used to detect the relative misalignment of an interconnect and a via plug, and includes an interconnect 10, a via plug 20 (first via plug), a via plug 30 (second via plug), and a conductor 40. The upper surface (first surface) and the lower surface (second surface) of the interconnect 10 are connected with the via plug 20 and the via plug 30 respectively. The conductor 40 is provided on the same layer as the interconnect 10 at a predetermined interval therefrom. COPYRIGHT: (C)2009,JPO&INPIT |
