CASE FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

An electronics product case and a manufacturing method thereof are provided to prevent the separation between the different kind material case and micro-crack due to the difference of the displacement variation according to the temperature change. An electronics product case comprises: a first case(100); a second case made of material which has different coefficient of thermal expansion of the first case; a first binder layer(120) having the coefficient of thermal expansion which is more similar to the coefficient of thermal expansion of the first case than the coefficient of thermal expansion of the second case; a second binder layer(130) having the coefficient of thermal expansion which is more similar to the coefficient of thermal expansion of the second case(110) than the coefficient of thermal expansion of the first case; and a first diffusion layer having the coefficient of thermal expansion between the coefficient of thermal expansion of the first binder layer and the coefficient of thermal expansion of the second binder layer.