| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which improves pattern collapse and line edge roughness performance and forms a pattern of good profile and to provide a pattern forming method using the same. <P>SOLUTION: The positive photosensitive composition comprises (A) a compound capable of generating an acid represented by general formula (II) upon irradiation with actinic rays or radiation, and (B) a resin, and increases its dissolution rate in an alkali developer by the action of an acid which contains an acid decomposable repeating unit represented by general formula (I). The pattern forming method using the same is also provided. In the formulae, each symbol represents a predetermined atom or group. <P>COPYRIGHT: (C)2009,JPO&INPIT |
