| 摘要 |
<P>PROBLEM TO BE SOLVED: To surely ensure isolation for a high-frequency signal between the input and output of a high-frequency semiconductor without enlarging a package. <P>SOLUTION: A high-frequency package has a dielectric board 5 and the high-frequency semiconductor 3 flip-chip mounted on the dielectric board 5, and forms an input line 1 and an output line 2, holding the high-frequency semiconductor 3 on the dielectric board 5. In the high-frequency package, a resistance film 8 is formed at a place opposed to the high-frequency semiconductor 3 on the dielectric board 5, and the resistance film 8 is connected by a grounding conductor 6 and through-holes 7 formed to the dielectric board 5. <P>COPYRIGHT: (C)2009,JPO&INPIT |
