POLISHING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THIS, AND SEMICONDUCTOR DEVICE MANUFACTURED BY THIS METHOD

摘要

PROBLEM TO BE SOLVED: To provide a polishing device improved in through-put.

SOLUTION: This polishing device 1 is configured to set a gain value and a dress time of a polishing pad 13 in a dress position control of a dresser 30 according to a dress rate by a polishing control section 60 in an adjust process before start of a series of polishing processes for polishing a plurality of semiconductor wafers W successively by a polishing tool 10.

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