| 摘要 |
PROBLEM TO BE SOLVED: To provide a conveyor for vacuum-sucking a substrate such as a semiconductor wafer for conveyance which safely conveys the substrate without a cause of damage on the substrate. SOLUTION: The conveyor 77 of a grinding device 10 comprises a suction means 78 having a suction pad 80 formed of an elastic member, a vacuum means, a moving means 81 and a deposit removing means 83. The wafer 1 completed with grinding is vacuum-sucked to a suction surface 80a of the suction pad 80 and transferred by the moving means 81 to a spinner-type cleaning apparatus 94. Upon completion of the transfer of the wafer 1, a motor 84 of the deposit removing means 83 is activated to rotate a bite 90. While the suction means 78 moves by the moving means 81 toward a chuck table 20, the bite 90 comes into slide contact with the entire suction surface 80a to remove ground wastes attaching to the suction surface 80a. COPYRIGHT: (C)2009,JPO&INPIT |
