| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board capable of transferring heat to a plurality of core substrates uniformly in an anneal process, and reducing a variation in substrate shrinkage. SOLUTION: The multilayer wiring board has the core substrates and build-up layers arranged on the upper and lower surfaces of the core substrates. In the method of manufacturing the multilayer wiring substrate, a plurality of double-sided copper-clad laminates 48, where metal foil is bonded onto the main surface of an insulating board including a resin material, are prepared in a preparation process. In the anneal process, a storage rack 50 is used to arrange the plurality of double-sided copper-clad laminates 48 vertically with a gap for heating respective double-sided copper-clad laminates 48 in a hot blast dryer 51. COPYRIGHT: (C)2009,JPO&INPIT |
