| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve adhesion of an electric circuit pattern and the resin film of an upper layer in a multilayer substrate constituted by laminating a plurality of resin films on one surface of which an electric circuit pattern is formed. <P>SOLUTION: A plurality of wiring layers 1-4 for which electric circuit patterns 1b-4b whose surface is turned to a shiny surface are formed on one surface of the resin films 1a-4a are prepared, and an organic rust-proof coating 10 is formed only on the surfaces of the respective electric circuit patterns 1b-4b of the plurality of wiring layers 1-4. Then, the plurality of wiring layers 1-4 are stacked, the respective wiring layers 1-4 are heated and thermally pressed, the rust-proof coating 10 formed on the electric circuit patterns 1b-4b is made to disappear by thermal decomposition, and the shiny surfaces of the electric circuit patterns 1b-4b and the other surfaces of the resin films 1a-4a are thermally fused. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
